SSD - 256 GB - internal - M.2 2280 - PCIe 3.1a x4 (NVMe)
| Main Specifications | |
|---|---|
| Product Description | Toshiba XG6 - SSD - 256 GB - PCIe 3.1a x4 (NVMe) |
| Type | Solid state drive - internal |
| Capacity | 256 GB |
| NAND Flash Memory Type | 3D triple-level cell (TLC) |
| Form Factor | M.2 2280 |
| Interface | PCIe 3.1a x4 (NVMe) |
| Features | 96-layer 3D NAND technology, 3D BiCS Flash, Storage Interface Interactions Specification(SIIS), NVM Express (NVMe) 1.3a |
| Dimensions (WxDxH) | 0.9 in x 3.1 in x 0.1 in |
| Weight | 0.25 oz |
| General | |
| Device Type | Solid state drive - internal |
| Capacity | 256 GB |
| NAND Flash Memory Type | 3D triple-level cell (TLC) |
| Form Factor | M.2 2280 |
| Interface | PCIe 3.1a x4 (NVMe) |
| Features | 96-layer 3D NAND technology, 3D BiCS Flash, Storage Interface Interactions Specification(SIIS), NVM Express (NVMe) 1.3a |
| Width | 0.9 in |
| Depth | 3.1 in |
| Height | 0.1 in |
| Weight | 0.25 oz |
| Miscellaneous | |
| Compliant Standards | VCCI, ICES-003, EN55024, CISPR 22, FCC Part 15 B, UL 60950-1, EN 60950-1, BSMI CNS 13438, CAN/CSA C22.2 No. 60950-1-07, KN32, KN35, EN 55032, AS/NZS CISPR 32 |
| Power | |
| Power Consumption | 4 Watt (read) ¦ 2.4 Watt (write) |
| Environmental Parameters | |
| Min Operating Temperature | 32 °F |
| Max Operating Temperature | 185 °F |
| Min Storage Temperature | -40 °F |
| Max Storage Temperature | 185 °F |
| Shock Tolerance (operating) | 1500 g @ 0.5 ms |
| Shock Tolerance (non-operating) | 1500 g @ 0.5 ms |
| Vibration Tolerance (operating) | 20 g @ 10-2000 Hz |
| Vibration Tolerance (non-operating) | 20 g @ 10-2000 Hz |
| Performance | |
| Internal Data Rate | 2900 MBps (read) / 2000 MBps (write) |
| Reliability | |
| MTBF | 1,500,000 hours |
| Expansion & Connectivity | |
| Interfaces | - M.2 M key |
| Compatible Bay | M.2 2280 |